Effect of annealing temperature on microstructure and tensile properties of copper/aluminum composite thin strip

The effect of annealing temperature on the microstructure and tensile properties of copper/aluminum (Cu/Al) composite thin strips was studied to improve the mechanical properties of materials. The change of interface layer, the diffusion of interface elements, and the microstructural evolution of each matrix of Cu and Al were observed and analyzed using scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and electron back-scatter diffraction (EBSD) techniques. The tensile properties of the Cu/Al composite thin strip were studied by static uniaxial tensile tests. The results show that recrystallization occurs in the Cu/Al matrix during annealing process, and the grains of the Al matrix grow into coarse grains after annealing at 400 °C. The thickness of diffusion layer increases with the increase…