Journal ArticleOpen Access
Effects of temperature and strain rate on tensile properties of (Ag,Cu)-Sn intermetallic compounds: A molecular dynamics study
Author Affiliations
Bangladesh University of Engineering and Technology, Chittagong University of Engineering & Technology
Published InJournal of Materials Research and Technology
Year2022
Citations20
Abstract
With the advent of environment friendly microelectronic packaging technologies, the demand of lead-free solders alloy has escalated. Leadfree solder material is an alloy of Tin (Sn), Silver (Ag) and Copper (Cu) and is widely known as SAC solder. Intermetallic compounds (IMC) like Ag3Sn, Cu3Sn and Cu6Sn5 are proven to adversely affect the mechanical properties of lead-free solder joints. This study presents the effects of temperature and strain rate on mechanical performances of these IMCs found in SAC solders. In addition, weakest and most sensitive IMC among these is detected. Modified embedded atom method potential parameters are used in LAMMPS to simulate the stress-strain behavior with deformation evolution of intermetallic compounds in different temperature and strain rates. The simulation was performed…
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