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16+ results
Field: Electronic Packaging and Soldering Technologies

<italic>In Situ</italic> Diagnostics and Prognostics of Solder Fatigue in IGBT Modules for Electric Vehicle Drives

Verified

Bing Ji, Xueguan Song, Cao Wenping, Volker Pickert et al.

Journal: IEEE Transactions on Power Electronics
Year: 2014
Citations: 195

This paper proposes an in situ diagnostic and prognostic (D&P) technology to monitor the health condition of insulated gate bipolar transistors (IGBTs) used in EVs with a focus on the IGBTs' solder layer fatigue. IGBTs' thermal impedance and the junction temperature can be used as health indicators ...

Physical SciencesEngineeringElectrical and Electronic EngineeringOpen Access
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Transient liquid phase Ag-based solder technology for high-temperature packaging applications

Verified

Ahmed Sharif, Chee Lip Gan, Zhong Chen

Journal: Journal of Alloys and CompoundsYear: 2013Citations: 85
Physical SciencesEngineeringElectrical and Electronic EngineeringOpen Access
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The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Verified

Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif et al.

Journal: Journal of Alloys and CompoundsYear: 2010Citations: 82
Physical SciencesEngineeringElectrical and Electronic Engineering
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Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Verified

Tama Fouzder, Shafiq Ismathullakhan, Y.C. Chan, Ahmed Sharif et al.

Journal: Journal of Alloys and CompoundsYear: 2010Citations: 72
Physical SciencesEngineeringElectrical and Electronic Engineering
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Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy

Verified

Sourav Das, Ahmed Sharif, Y.C. Chan, N. B. Wong et al.

Journal: Journal of Alloys and CompoundsYear: 2009Citations: 71
Physical SciencesEngineeringElectrical and Electronic Engineering
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Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties

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Md Muktadir Billah, Kazi Mohammad Shorowordi, Ahmed Sharif

Journal: Journal of Alloys and CompoundsYear: 2013Citations: 66
Physical SciencesEngineeringElectrical and Electronic Engineering
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Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

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Mansur Ahmed, Tama Fouzder, Ahmed Sharif, Asit Kumar Gain et al.

Journal: Microelectronics ReliabilityYear: 2010Citations: 59
Physical SciencesEngineeringElectrical and Electronic Engineering
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Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Verified

Asit Kumar Gain, Y.C. Chan, Ahmed Sharif, N. B. Wong et al.

Journal: Microelectronics ReliabilityYear: 2009Citations: 45
Physical SciencesEngineeringElectrical and Electronic Engineering
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Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads

Verified

Tama Fouzder, Asit Kumar Gain, Y.C. Chan, Ahmed Sharif et al.

Journal: Microelectronics ReliabilityYear: 2010Citations: 38
Physical SciencesEngineeringElectrical and Electronic Engineering
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Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

Verified

Asit Kumar Gain, Tama Fouzder, Y.C. Chan, Ahmed Sharif et al.

Journal: Journal of Alloys and CompoundsYear: 2009Citations: 32
Physical SciencesEngineeringElectrical and Electronic Engineering
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Heat-Flux-Based Condition Monitoring of Multichip Power Modules Using a Two-Stage Neural Network

Verified

Borong Hu, Zedong Hu, Li Ran, Chong Ng et al.

Journal: IEEE Transactions on Power ElectronicsYear: 2020Citations: 29

Power semiconductor chips are paralleled in modules to increase current rating. Under thermo-mechanical stresses in service, the die-attach solder layers will gradually develop into different levels of degradation. Early fault detection requires to monitor the occurrence of such an uneven degradatio...

Physical SciencesEngineeringElectrical and Electronic Engineering
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Atomistic analysis of the thermomechanical properties of Sn–Ag–Cu solder materials at the nanoscale with the MEAM potential

Verified

Mohammad Motalab, Ratul Paul, Sourav Saha, Satyajit Mojumder et al.

Journal: Journal of Molecular ModelingYear: 2019Citations: 27

Sn-Ag-Cu, commonly known as SAC, is considered to be among the most promising of all lead-free solder alloys. Research aimed at making electronic components smaller has pointed to the possible use of nanosized solder joints in the future. In this study, for the first time, molecular dynamics simulat...

Physical SciencesEngineeringElectrical and Electronic Engineering
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Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn–Zn binary solder and Au/Ni/Cu bond pads

Verified

Sourav Das, Ahmed Sharif, Y.C. Chan, N. B. Wong et al.

Journal: Microelectronic EngineeringYear: 2009Citations: 23
Physical SciencesEngineeringElectrical and Electronic Engineering
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Characteristics of eutectic and near-eutectic Zn–Al alloys as high-temperature lead-free solders

Verified

M. M. Hasan, Ahmed Sharif, M. A. Gafur

Journal: Journal of Materials Science Materials in ElectronicsYear: 2019Citations: 22
Physical SciencesEngineeringElectrical and Electronic Engineering
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Effects of temperature and strain rate on tensile properties of (Ag,Cu)-Sn intermetallic compounds: A molecular dynamics study

Verified

Md. Maruf Billah, Rashik Intisar Siddiquee, Mohammad Motalab, Ratul Paul et al.

Journal: Journal of Materials Research and TechnologyYear: 2022Citations: 20

With the advent of environment friendly microelectronic packaging technologies, the demand of lead-free solders alloy has escalated. Leadfree solder material is an alloy of Tin (Sn), Silver (Ag) and Copper (Cu) and is widely known as SAC solder. Intermetallic compounds (IMC) like Ag3Sn, Cu3Sn and Cu...

Physical SciencesEngineeringElectrical and Electronic EngineeringOpen Access
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