Journal ArticleUnknown
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads
Authors
Author Affiliations
City University of Hong Kong, Bangladesh University of Engineering and Technology, Hong Kong Polytechnic University
Published InMicroelectronics Reliability
Year2010
Citations38
Abstract
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