Journal ArticleUnknown
Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
Authors
Author Affiliations
City University of Hong Kong, Bangladesh University of Engineering and Technology, Hong Kong Polytechnic University
Published InJournal of Alloys and Compounds
Year2010
Citations72
Abstract
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