Journal ArticleUnknown
Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn–Zn binary solder and Au/Ni/Cu bond pads
Authors
Author Affiliations
City University of Hong Kong, Bangladesh University of Engineering and Technology, Hong Kong Polytechnic University
Published InMicroelectronic Engineering
Year2009
Citations23
Abstract
No abstract is available for this paper from the publisher. Use the link below to view the full record at the source.
View at Publisher
BORR does not host full-text PDFs. The button above takes you to the original publisher.