Journal ArticleUnknown

Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

Authors

Asit Kumar Gain, Tama Fouzder, Y.C. Chan, Ahmed Sharif, …

Author Affiliations

City University of Hong Kong, University of Development Alternative, Bangladesh University of Engineering and Technology, Hong Kong Polytechnic University

Published InJournal of Alloys and Compounds

Year2009

Citations32

DOI10.1016/j.jallcom.2009.09.150

Abstract

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Fields & Keywords

Physical Sciences Engineering Electrical and Electronic Engineering Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Advanced Welding Techniques Analysis Metallurgy Composite material Soil science